| Material |
Nominal compostion
(wt.% unless noted) of structure |
Application examples |
| Pure molybdenum |
| Mo |
Min 99.95-99.97Mo(depending on the producer) |
Constitutes the majority of Mo metal products fumace and glass melting components, ppower semiconductor heat sinks. sputtering targets used to manufacture thin films in flat-panel displays and thin-film solar cells. poweders spray-dried with either organic binders for high-speed pressing. or ADM for thermal spray applications |
| Alloys |
| Substitutional alloys |
| Mo-W |
10~50W |
Equipment for handing molten zn, glass stirrers |
| Mo-Re |
3 Re, 5Re, 41_47.5 Re |
Thermocouples (low Re) and applications requiring low-temperature ductitly(high Re) |
| Mo-Ta |
10.7 Ta |
Thin films in touch-screen displays |
| Mo-Nb |
3.0-9.7 Nb |
Thin films in touch-screen displays |
| Carbide-stabilized alloys |
| TZM |
0.5 Ti-0.08 Zr-0.03C |
Isothermal forging dies, injection molding tooling.
metalworking tools, X-ray targets |
| MHC |
1.2 Hf-0.08 C |
Extrusion dies, metalworking tools |
| Dispersion-strengthened alloys |
| Mo-La2O3 |
0.43-1.20 La, 0.075-0.21 O |
Furnace heating elements, sintering boats, lamp components |
| Mo-ZrO2 |
1.24 Zr. 0.43 O |
Glass-melting furnace components |
| K/Si doped |
0.01-0.07 Si, 0.005-0.03 K, 0.01-0.07 O |
Lamp components, heating elements |
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